Electronic components; wafers; semiconductor wafers; wafers for integrated circuits; silicon wafers; epitaxial wafers; compound semiconductor wafers; gallium arsenide based wafers; indium phosphide based wafers; gallium nitride based wafers; gallium antimonide based wafers; indium antimonide based wafers; group IV wafers; sapphire-based wafers; III-V semiconductors; parts and fittings of all the aforesaid goods.;
40
NICE Classification
Custom manufacturing services; custom manufacture of electronic, wireless, photonic, optoelectronic, infrared, photovoltaic, power control and Microelectromechanical systems (MEMS) components; custom manufacture of wafer products; information and advisory services relating to all the aforesaid services.;
42
NICE Classification
Technical support services; technical support services in relation to electronic, wireless, photonic, optoelectronic, infrared, photovoltaic, power control and Microelectromechanical systems (MEMS) components; technical support services in relation to wafer products; information and advisory services relating to all the aforesaid services.;
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